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2012 Conference Publication Effect of cooling rate on the intermetallic layer in solder jointsSweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries. |
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2012 Conference Publication Industry-university collaboration and advances in lead-free solder technologyNogita, Kazuhiro (2012). Industry-university collaboration and advances in lead-free solder technology. Proc. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012. |
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2012 Conference Publication The stability of Cu6Sn5 in the formation and performance of lead-free solder jointsSweatman, Keith, Nishimura, T. and Nogita, Kazuhiro (2012). The stability of Cu6Sn5 in the formation and performance of lead-free solder joints. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012. |
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2012 Conference Publication Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5Mu, Dekui, Huang, Han and Nogita, Kazuhiro (2012). Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. TMS 2012 141st Annual Meeting and Exhibition, Orlando, United States, 11-15 March 2012. |
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2011 Conference Publication Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder jointsMu, D., Read, J., Yang, Y-F. and Nogita, K. (2011). Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints. International Conference on Electronic Packaging (ICEP 2011), Nara, Japan, 13-15 April 2011. Nara, Japan: The Japan Institute of Electronics Packaging. |
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2011 Conference Publication The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free soldersSweatman, Keith, Read, J., Nishimura, T. and Nogita, Kazuhiro (2011). The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders. SMTA International, Fort Worth, Texas, United States, 16-20 October 2011. |
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2010 Conference Publication Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFSNogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2851 |
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2010 Conference Publication Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interfaceTsukamoto, Hideaki, Dong, Zigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2010). Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2-6 August, 2010. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2446 |
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2010 Conference Publication Trace element distribution in solder joints between Sn-based solders and Cu substratesNogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2010 Conference Publication Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder jointsMu, Dekui, Tsukamoto, Hideaki, Huang, Han and Nogita, Kazuhiro (2010). Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, 2-6 August, 2010. Stafa-Zurich ; United Kingdom: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2450 |
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2010 Conference Publication Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racingNogita, K., Greaves, M., Guymer, B., Walsh, B., Kennedy, J., Duke, M. and Nishimura, T. (2010). Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racing. International Conference on Electronics Packaging 2010, Sapporo, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2009 Conference Publication Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni AlloysNogita, Kazuhiro (2009). Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni Alloys. Switzerland: Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/MSF.618-619.391 |
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2009 Conference Publication The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substratesNogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009. |
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2009 Conference Publication Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfacesNogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging. |
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2009 Conference Publication Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substratesHideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging. |
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2009 Conference Publication The Effect of Ni on Phase Stability in Cu6Sn5Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009. |
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2009 Conference Publication The influence of Ni additions on the solidification of Sn-0.7%Cu solderT. Ventura, C. M. Gourlay, K. Nogita, M. Rappaz and A. K. Dahle (2009). The influence of Ni additions on the solidification of Sn-0.7%Cu solder. Materials and AustCeram 2009 Conference, Gold Coast, Australia, 1-3 July 2009. |
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2009 Conference Publication Ball impact behavior of Sn-Cu (-Ni) lead-free solder jointsTsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009. |
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2009 Conference Publication Effect of intermetallic stabilization on the impact resistance of joints to BGA packagesSweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro and Nishimura, Tetsuro (2009). Effect of intermetallic stabilization on the impact resistance of joints to BGA packages. 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, 9 - 11 December 2009. Piscataway, NJ United States: I E E E. doi: 10.1109/EPTC.2009.5416526 |
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2009 Conference Publication The influence of solder composition on the impact strength of lead-free solder BGA jointsTsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS. |
